Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

November 25, 2025

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

November 25, 2025

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

November 25, 2025

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology

PRESS RELEASE

Singapore, November 20, 2025 – Dr. Byung Joon Han, co-founder and CEO of Silicon Box attended the Bloomberg New Economy Forum (NEF) 2025, joining leaders from across 50 countries to discuss technology, trade, and supply chain resilience. Under the theme of “Thriving in the Age of Extremes”, the forum is focused on driving economic growth by convening government, the private sector and key decision makers to amplify programs that build strategic alliances across borders. 


In an exclusive interview on the forum grounds, with Avril Hong and Shery Ahn for The Asia Trade segment on Bloomberg TV, Dr. Han shared his perspective on the current state of Silicon Box’s business and the semiconductor industry, growth in AI demand, and the company’s expansion plans. 

Mike Han, Head of Business, receives the NextGen Tech 30 Award at SGX Singapore

Key Insights from the interview 



  • Artificial intelligence is attracting significant attention, but AI and high-performance computing applications represent only about 40% of the company’s current demand. Silicon Box’s customer markets also include RF, data centers, electric vehicles, satellite and space technology, mobile, power, and wearables. “We see big demand in AI, of course, but we also start to see the recovery in a lot of other businesses including mobile, automotive, and especially power chips,” said Dr. Han. 


  • Maintaining flexibility and collaboration in the semiconductor supply chain is a key factor in advancing the industry’s transition to chiplets. Silicon Box upholds this position through a commitment to innovation, while offering a distinctive solution backed by robust intellectual property protections, end-to-end collaboration, and a customer-first approach. “A neutral position is important because we are sort of uniquely positioned to supply the technology to many customers. And [if we are leaning too much to one side] our important mission is disrupted,” explained Dr. Han.


  • Navigating supply chain disruptions caused by geopolitical tensions has become the new normal for the semiconductor industry. Legacy businesses face increasing challenges, but new companies introducing new and flexible solutions to customers have the opportunity to build supply chains that meet these emergent industry realities. “I think it is an opportunity for us because [we] have the luxury [to enable customers to] design a new supply chain [unlike] a big, [legacy] company having to change [their existing supply chain], which is not an easy job,” shared Dr. Han. 


Advancing semiconductor technology relies on innovation corridors 


“Our CEO’s conversation with Bloomberg News, during the New Economy Forum, was unexpectedly timely. The theme of this year’s forum and key takeaways from many of the speakers participating in the event, aligns well with the vision and values of Silicon Box to advance technology and supply chain agility through collaboration and pragmatism,” shared Mike Han, Head of Business who was also present at the event. 


“We were impressed with the forum, which featured highly current conversations and perspectives from global leaders across business and policy that were notably candid and insightful. This encouraged attendees to think harder about the current situation, from different angles. With the emergence of the digital era or ‘new economy’, it will be increasingly important to have forums like these to nurture the understanding and collaboration necessary to ensure the decisions we make will serve the best interests of humanity. This is part of Silicon Box’s mission statement, and we appreciate the opportunity to attend this event.” 


Silicon Box’s recent achievement in reaching high-volume production at high yield and its commitment to open a second factory in Novara, Piedmonte, with the support of the European Commission and Italian central government under the EU Chips Act; both mark significant milestones for proving advanced panel-level semiconductor packaging and chiplet technologies. At the same time, these milestones demonstrate the importance of strategic policy making and international collaboration to deploy critical innovation at scale during this time of rapid geopolitical change and technological development. 


About Silicon Box 

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance, affordable alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS ChipPAC for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com/timeline. 


Forward-Looking Statements: 

This report contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box’s planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release. All information in this press release reflects management’s views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. 


### End of Release ### 


Contact us 

Press: janice.yeo@silicon-box.com 

Investors: mike.han@silicon-box.com   


Share on


Finished packages from Silicon Box's advanced panel level package line
October 15, 2025
Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications
Mike Han receiving the NextGen Tech 30 award on behalf of Silicon Box st SGX Singapore
October 13, 2025
Silicon Box was recognized by leading multi-asset manager and venture capital leader Granite Asia – formerly GGV Capital Asia – as a 2025 NextGen Tech 30 Honouree.
Silicon Box Building
July 1, 2025
As an industry pioneer in end-to-end technical expertise and capacity to deliver advanced packaging for next-gen semiconductors at scale, Silicon Box continues to expand its support for all customers that seek to differentiate their technology with the performance and cost efficiencies of chiplet-based solutions.
Colleagues on the rooftop of Silicon Box
June 13, 2025
To mark the significance of Father’s Day, Silicon Box asked three of our working fathers – Suresh, Meng Keat and Andy --- to share how fatherhood has transformed their lives personally and professionally.
May 8, 2025
Mother's Day serves as an annual reminder to reflect on the remarkable impact mothers have on individuals and society. To mark its significance, Silicon Box asked three of our working mothers – Katy, May and Jick, who have been with Silicon Box since its early days
Silicon Box
May 4, 2025
After working as an engineer in the electronics industry for over a decade, Anand, driven by his passion for improving processes and ensuring a safe work environment, decided to pivot and take up an opportunity with the Environmental, Health, and Safety (EHS) team. He has not looked back since.
Dr. Han receiving the 2025 Leonardo International Award
April 16, 2025
The award recognizes Dr. Han’s exceptional contributions to onshore advanced integration and packaging technology in Italy, strengthening the wider EU semiconductor ecosystem
Four female engineers standing together for a photo
February 13, 2025
At Silicon Box, this future is driven by tenacious and resilient women revolutionizing the semiconductor industry through a passion for innovation and an unwavering commitment to excellence that allows our customers to break limits.
January 14, 2025
Meet Beth, a dedicated team member whose journey in the semiconductor industry showcases her unwavering commitment to professional growth. Captivated by the fast-paced and innovation-driven nature of the field, Beth eagerly embraces new challenges while nurturing her passion for continuous learning.
December 19, 2024
ROME, Italy, December 19 - Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy . The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities. The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first manufacturing expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging. "This strategic investment in Italy represents a pivotal moment in Europe's semiconductor renaissance," says Dr. Byung Joon Han, Chief Executive Officer of Silicon Box. "By bringing our advanced packaging technologies to the heart of Europe, we're not just expanding our global footprint – we're creating a cornerstone of the EU's semiconductor ecosystem that will serve critical sectors from automotive to artificial intelligence." Project Details and Timeline The new first-of-its-kind advanced manufacturing facility in Novara will feature: Panel-level packaging and heterogeneous integration capabilities R&D center focusing on next-generation packaging solutions Industry 4.0 automated manufacturing systems Key net-zero technologies to minimize carbon footprint and environmental impact Construction is expected to begin in the second half of 2025, with initial production planned for Q1 2028. The plant is expected to be operating at full capacity in 2033, processing approximately 10,000 panels per week. Regional Impact and Partnerships Under the Italian measure, Silicon Box is committed to strengthening Italy’s and the wider EU semiconductor value chain by bringing in advancing packaging technologies, managing supply shortages through priority orders, and developing workforce training programs. Silicon Box is already in talks with the local government to develop partnerships with educational institutions and workforce programs to cultivate a robust native talent which will include technicians and maintenance workers with expertise in automation, robotics, mechatronics, computer science, and graduates in electronic, mechanical, management, chemical and physical engineering. “We're committed to creating high-quality jobs, fostering local partnerships, and driving technological advancements that will benefit our customers and the broader economy, " says Michael Han, Head of Business, Silicon Box. “Silicon Box would like to express our gratitude to the Ministry of Enterprises and Made in Italy, Piedmonte government, local officials, and our partners for supporting this expansion. Silicon Box remains committed to driving innovation, ensuring supply chain resilience, and contributing to the economic growth of Italy and beyond.” Silicon Box’s key manufacturing services will enable the adoption of chiplets and high-performance alternatives that require integrating a wide variety of technology nodes and materials. The plant will specialize in advanced packaging solutions for AI, high-performance computing (HPC), data centers, automotive, mobile, IoT and robotic applications, addressing Europe's growing demand for advanced chip technologies. ### Forward looking statement: This press release contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box’s planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release. All information in this press release reflects management’s views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. Inquiries Media: janice.yeo@silicon-box.com | media_enquiries@silicon-box.com Investors: mike.han@silicon-box.com About Silicon Box Silicon Box is an advanced semiconductor packaging company, specializing in cutting edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS ChipPAC (SSE: 600584) for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group (NASDAQ: MRVL) in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com
More Posts