Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

June 28, 2024

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

June 28, 2024

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

June 28, 2024

Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion

Advanced packaging facility in Piedmont to bring first-of-a-kind semiconductor manufacturing capabilities to Europe, enable chiplet architecture 

  • Silicon Box selects site near Novara, in Piedmont, as location for advanced packaging facility, planned to begin construction second half of 2025 and to begin production in 2028
  • Investment of up to €3.2B ($3.6B) will create approximately 1,600 semiconductor jobs at Silicon Box’s new manufacturing facility, and create thousands of indirect supplier and contract construction jobs
  • New Italian facility will enable next generation applications in artificial intelligence (AI) supporting large language models (LLM), high performance computing (HPC), electric vehicles (EV) and automotive, wearables, mobile, smart consumer, edge computing and more by providing advanced packaging and test capacity, anticipated to be in demand in the coming years
  • Silicon Box’s investment will align with the Italian government and the European Commission and Union’s goal of a more resilient semiconductor supply chain and to drive innovation 


ROME, Italy – The co-founders of Silicon Box, CEO Dr. Byung Joon (BJ) Han, Dr. Sehat  Sutardja, and Weili Dai, together with the Minister Adolfo Urso, Presidente Alberto Cirio of  the Piedmont region, and Mayor Alessandro Canelli of the municipality of Novara today  announced that Novara in Piedmont will be the site of the company’s new, first-of-a-kind  advanced semiconductor packaging and testing foundry. The parties signed a letter of  intent outlining their commitment for collaboration related to the site and investment, this  morning, at the Ministry of Enterprises and Made in Italy in Rome, subject to the European  Commission approval of the planned financial support to be granted by Italy. 


The site in Novara and Piedmont was selected from a shortlist of sites and regions in  Northern Italy (Nord Italia) through a detailed evaluation process. This effort aimed at  ensuring that selection be aligned with the requirements and conditions necessary for the  planned facility, and prior commitments agreed between Silicon Box and the Italian  government.


“Silicon Box’s advanced packaging facility in Novara is expected to create up to 1,600  highly paid jobs and bring first-of-a-kind advanced semiconductor packaging and testing  capabilities to Italy, and to Europe,” said Dr. Byung Joon Han, CEO and cofounder of Silicon  Box. “We appreciate the cooperation of all the sites, municipalities and regions that  participated in our evaluation process. Every site was carefully reviewed and considered,  and each had its own independent merits that reinforced our decision to build in Italy.” 


Earlier this year, Silicon Box announced its intention to collaborate with the Italian  government to invest up to €3.2B ($3.6B) in Northern Italy, as the site of a state-of-the-art  semiconductor assembly and test facility. The facility will help meet critical demand for  advanced packaging capacity to enable next generation technologies that Silicon Box  anticipates by 2028. The multi-year investment replicates Silicon Box’s flagship foundry in  Singapore, which has demonstrated capability and capacity for the world’s most advanced  semiconductor packaging solutions, before further expansion into 3D integration and  testing. The new integrated production facility is expected to serve as a catalyst for broader  ecosystem investments and innovation in Italy, as well as the rest of the European Union. 


“We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor  industry, through this investment into the world’s most advanced packaging solution. It will  enhance competitive strengths in design, artificial intelligence (AI), large language models  (LLMs), electronic vehicles (EVs) and automotive, mobile, wearables, smart consumer,  edge computing, and material sciences of the Italian ecosystem, and revolutionize  Europe’s position in the global [semiconductors] supply chain,” said Dr. Sehat Sutardja, co founder and Chairman of Silicon Box.  


“Design and planning for the facility is already underway, with construction to commence  pending European Commission approval of planned financial support by the Italian State,”  added co-founder, Weili Dai.


Silicon Box’s technology enables advanced chiplet integration (“advanced packaging”), on  a large manufacturing format for scale and efficiency. The chiplet concept is an alternative  to conventional semiconductor manufacturing, which focused on building entire systems on-chips (SoCs) on silicon wafers, then moving to traditional packaging processes.  Chiplets describe manufacture of individual system modalities as standalone “chiplets” on  a wafer, then integrating these separate functionalities into a system through advanced  packaging, creating a system-in-package (SiPs). 


The chiplet concept itself was introduced by Silicon Box co-founder Dr. Sutardja at the  International Solid State Circuits Conference (ISSCC) in 2015, where he was plenary speaker. Dr. Han is the inventor of semiconductor packaging solutions fundamental to  enable chiplets through advanced packaging. Their long-standing collaboration has been  the basis for Silicon Box’s record-breaking progress as a company in the semiconductor  manufacturing space, traditionally dominated by a few large companies. 


Silicon Box’s Novara factory is planned to begin construction second half of 2025, with initial  production expected to begin in 2028.

Forward-Looking Statements

This press release contains forward-looking statements that involve a number of risks and  uncertainties. Such statements include: our manufacturing expansion and investment  plans and expectations in the European Union (EU) and the anticipated benefits therefrom;  anticipated supplier, ecosystem, community, and government support and approval for our  planned EU investments and anticipated benefits related to such support; environmental  plans for and benefits from our factories and technologies; and other characterizations of  future plans, expectations, events, or circumstances. 


Such statements involve risks and uncertainties that could cause our actual results to  differ materially from those expressed or implied, including: changes in demand for our  products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and  proposed transactions; construction delays or changes in plans due to business,  economic, or other factors; increases in capital requirements and changes in capital  investment plans; adverse changes in anticipated government incentives and associated  approval related to Silicon Box’s planned EU investments; adverse legislative or other  government actions; insufficient ecosystem support; the impact of macroeconomic and  geopolitical trends and events; and other risks and uncertainties described in this press  release. 


All information in this press release reflects management’s views as of the date hereof,  unless an earlier date is specified. We do not undertake, and expressly disclaims any duty,  to update such statements, whether as a result of new information, new developments, or  otherwise, except to the extent that disclosure may be required by law. 

About Silicon Box

Silicon Box is an advanced semiconductor packaging company, specializing in cutting edge integration technology and manufacturing processes. We offer solutions that enable  chiplet architecture, as well as high performance alternatives to traditional packaging  schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of  chiplet adoption in order to build the emergent technologies shaping the world around us  today.


Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja and Weili  Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest  outsourced assembly and test provider, STATS ChipPAC (SSE: 600584) for two decades,  taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of  the most advanced packaging solutions in today’s market, and his team at Silicon Box  holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology  Group (NASDAQ: MRVL) in 1995, and ran the company for twenty years from a start-up to  an over $50B market value company. 


To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com

Share on


June 8, 2026
SINGAPORE — 8 June 2026 — Silicon Box , a pioneer in advanced semiconductor panel-level packaging and chiplet integration, today announced that it has secured SGD 100 million in debt financing from leading institutional investors – funds managed by Ares Management Corporation (“ Ares ”), InnoVen Capital , January Capital Growth Credit (“January Capital”) , and Abound Capital . The facility includes an option to upsize by an additional USD 75 million. As traditional monolithic scaling approaches physical and economic limits, Silicon Box’s proprietary SiPlet® technology and panel-level packaging solutions are addressing critical bottlenecks in next-generation semiconductor design. Since its first high-volume manufacturing announcement last year, Silicon Box, as of Q1 2026, has achieved significant commercial traction, including the shipment of over 250 million units at near-perfect yield from its flagship Singapore manufacturing facility. “We are pleased to support Silicon Box in this next phase of growth,” said Dinesh Goel, Partner at Ares . “The company has demonstrated strong execution capabilities and operates at the leading edge of advanced packaging – a strategically important segment of the semiconductor value chain. We believe that Silicon Box is well-positioned to scale globally, and this financing reflects our confidence in the management team and the long-term growth outlook for advanced packaging.” “In capital-intensive industries like semiconductor manufacturing, access to flexible and scalable funding is critical to capturing growth opportunities. The proceeds will be deployed for capacity expansion to meet the rapidly growing market demand,” said Dr. BJ Han, co-founder and CEO of Silicon Box . "This financing enhances our capital base while minimising shareholder dilution, and we are pleased to partner with Ares, InnoVen, Abound, and January Capital. Their support reinforces confidence in our strategy and enables us to execute on our global expansion plans." The financing follows closely on the company’s recently completed USD 150 million Series B2 equity round, further strengthens Silicon Box’s capital structure to support its next phase of growth, and accelerates the global deployment of its advanced packaging solutions. With a strengthened balance sheet following the combined debt and equity financing, Silicon Box is well-positioned to expand manufacturing capacity, support increasing customer demand, and further its leadership in advanced packaging for sectors such as artificial intelligence (AI), high-performance computing (HPC), mobile, Internet of Things (IoT), robotics, and space tech. About Silicon Box Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high-performance, affordable alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com/timeline . About Ares Management Corporation Ares Management Corporation (NYSE:ARES) is a leading global alternative investment manager offering clients complementary primary and secondary investment solutions across the credit, real estate, private equity and infrastructure asset classes. We seek to advance our stakeholders' long-term goals by providing flexible capital that supports businesses and creates value for our investors and within our communities. By collaborating across our investment groups, we aim to generate consistent and attractive investment returns throughout market cycles. As of March 31, 2026, Ares Management Corporation's global platform had over $644 billion of assets under management, with operations across North America, South America, Europe, Asia Pacific and the Middle East. For more information, please visit www.ares.com . About InnoVen Capital InnoVen Capital is Asia’s leading debt provider supporting high growth technology companies across Southeast Asia, China, and India. Established as a joint venture between Seviora (a wholly owned subsidiary of Temasek Holdings) and UOB, we actively support talented founders in Asia in growing their businesses. For more information, please visit https://innovencapital.com/ . About January Capital January Capital is a multi-strategy investment firm headquartered in Singapore, investing in technology businesses that will power growth across the Asia-Pacific region over the next decade and beyond. The firm serves as a capital solutions provider through its two core strategies: early-stage venture equity and growth-stage credit. Learn more at www.january.capital . About Abound Capital Abound Capital is a private credit and venture debt firm established in Singapore with a mission to expand access to alternative capital for entrepreneurs in Southeast Asia. We provide non-dilutive and flexible source of growth funding to early and growth stage companies across the region. For more information, please visit www.aboundcap.com . ### End of Release ### For further inquiries, contact us: For press: janice.yeo@silicon-box.com For investors: hz.wong@silicon-box.com
Dr. BJ Han giving a keynote at imec’s 6th Automotive Chiplet Forum (ACF)
April 15, 2026
Silicon Box will support the ACP’s research initiative with its end-to-end know-how in chiplet interconnection, from consulting on optimal chiplet architecture for sustainable and scalable technology roadmaps, to turnkey solutions for advanced packaging and testing.
CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum
November 25, 2025
CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum
Finished packages from Silicon Box's advanced panel level package line
October 15, 2025
Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications
Mike Han receiving the NextGen Tech 30 award on behalf of Silicon Box st SGX Singapore
October 13, 2025
Silicon Box was recognized by leading multi-asset manager and venture capital leader Granite Asia – formerly GGV Capital Asia – as a 2025 NextGen Tech 30 Honouree.
Silicon Box Building
July 1, 2025
As an industry pioneer in end-to-end technical expertise and capacity to deliver advanced packaging for next-gen semiconductors at scale, Silicon Box continues to expand its support for all customers that seek to differentiate their technology with the performance and cost efficiencies of chiplet-based solutions.
Colleagues on the rooftop of Silicon Box
June 13, 2025
To mark the significance of Father’s Day, Silicon Box asked three of our working fathers – Suresh, Meng Keat and Andy --- to share how fatherhood has transformed their lives personally and professionally.
May 8, 2025
Mother's Day serves as an annual reminder to reflect on the remarkable impact mothers have on individuals and society. To mark its significance, Silicon Box asked three of our working mothers – Katy, May and Jick, who have been with Silicon Box since its early days
Silicon Box
May 4, 2025
After working as an engineer in the electronics industry for over a decade, Anand, driven by his passion for improving processes and ensuring a safe work environment, decided to pivot and take up an opportunity with the Environmental, Health, and Safety (EHS) team. He has not looked back since.
Dr. Han receiving the 2025 Leonardo International Award
April 16, 2025
The award recognizes Dr. Han’s exceptional contributions to onshore advanced integration and packaging technology in Italy, strengthening the wider EU semiconductor ecosystem
More Posts